Electrical Building Practise Researcher

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Electrical Building Practise Researcher

About this opportunity:

Join Ericsson and help build the Radio Access Network of the future. As our products are built upon the latest technology defining the cutting-edge performance, we together with the industry need to go beyond ‘Moore’s Law’ by integrating silicon chips into more advanced packaging options. Now you can be part of the team that shape our future products.

The Digital System Technology unit is part of the Systems & Technology organization within Business Area Networks. We are responsible for technology leadership and research in digital technology and software with focus on wireless systems for 6G and beyond. This is achieved through concept studies, system design, test beds, and driving technical innovation.

We are now looking for an Electrical Building Practise Researcher with background in advanced electronic packaging, PCB-building practise, cooling- and interconnect technologies to join the Digital System Technology unit in Lund, Sweden.

We can offer you an interesting and developing career within an ever-changing technology area that exploits and expands the boundaries of physical realization.

What you will do:

You will be part of a team of professionals who represents a wide area of in-depth knowledge of the radio technology, and that are willing to share their knowledge in supporting you in your role and personal development, and yet you will be an essential member of a smaller team where your contribution will make a difference.

As an employee you will be empowered to make your own planning, in securing the progress of delivering results. Your assignment spans from technology scouting for future technology as well as implementation for proof of concept of new way of thinking.

The skills you bring

• M.Sc. degree within Material Science or Mechanical/Electrical engineering or equivalent technical education on university level
• Preferably at least 5 years’ experience within relevant technical area (or Ph.D)
• Fluent in written and spoken English

Experience of the below areas are meritorious:

• Experience of Package interconnect technology
• Experience of Substrate technologies (e.g. laminate, silicon) for MCM and SIP
• Experience of SI/PI simulations
• Experience of Thermal simulations, and Silicon cooling systems
• Experience of Advanced PCB technologies

Why join Ericsson?

At Ericsson, you´ll have an outstanding opportunity. The chance to use your skills and imagination to push the boundaries of what´s possible. To build solutions never seen before to some of the world’s toughest problems. You´ll be challenged, but you won’t be alone. You´ll be joining a team of diverse innovators, all driven to go beyond the status quo to craft what comes next.

What happens once you apply?

Click Here to find all you need to know about what our typical hiring process looks like.

Encouraging a diverse and inclusive organization is core to our values at Ericsson, that's why we champion it in everything we do. We truly believe that by collaborating with people with different experiences we drive innovation, which is essential for our future growth. We encourage people from all backgrounds to apply and realize their full potential as part of our Ericsson team. Ericsson is proud to be an Equal Opportunity Employer. learn more.

Primary country and city: Sweden (SE) || Lund

Req ID: 767398